Description
The SMD6032 series is square Surface Mount fuses are designed for high-end cloud computing servers, telecom base station power supplies, block chain servers, and new energy vehicle battery management systems, ROHS compliant, Halogen Free and lead(Pb) exempts of the requirements of ROHS Directive(2002/95/EC), with U.S. (UL/CSA) safety agency approvals. Provide board level primary and secondary circuit protection in a wide variety of applications. With excellent inrush current withstanding capability, excellent reliability for thermal and mechanic shock, also have a high reliability and stable solder ability, the caps are available in gold/silver plated.
Features
• Available in ratings of 1 to 100A• High interrupting rating -600A@75VDC• Very low cold resistance,temperature rise, and voltage drop• High inrush/surge current withstand capability• Surface mountable high current fuse• UL 248-1 and UL 248-14 recognized• Conforms to IEC/EN 60127-1and IEC/EN 60127-7
Benefits
• Single fuse solution for high current application• Suitable for a wide variety of voltage requirement and application• Enhances power efficiency• Avoids nuisance opening due to high inrush and surge current inherent in the system• Compatible with high volume assembly requirements
Applications
• Voltage regulator module for PC server• Cooling fan system for PC server• Storage system power• Basestation power supply• Power tools
Material Details
|
NO. |
Part Name |
Material |
|
1 |
End caps |
Brass plated with gold/silver |
|
2 |
Body |
Ceramic Tube |
|
3 |
Fuse |
Alloy wire |
|
4 |
Explosion proof sand |
Quartz sand |
Electrical Characteristics for Series
|
% of Ampere rating |
OpeningTime |
|
100% |
4 hours, Minimum |
|
200% |
60 sec., Max. |
Electrical Specifications by Item
|
目录编号Catalog No. |
额定电流Ampere Rating |
额定电压Voltage Rating |
分断能力 Breaking Capacity |
安规认证 Agency Approvals |
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UL |
CSA |
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BMT3263.0.2 |
200mA |
1000V/800V/750V/600V 500V/400V/350V/300V 250V/125V/80V 72V/63V/32V DC |
250V/125V/AC/DC |
10KA@300V350V400V500V600V750V800V 1000V AC/DC 1.5KA@250V125V 1KA@250V300V350V 400V500V AC/DC 1KA@32V DC63V72V80V |
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BMT3263.0.25 |
250mA |
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BMT3263.0.3 |
300mA |
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BMT3263.0.315 |
315mA |
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BMT3263.0.375 |
375mA |
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BMT3263.0.5 |
500mA |
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BMT3263.0.63 |
630mA |
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BMT3263.0.8 |
800mA |
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BMT3263.1 |
1A |
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BMT3263.1.25 |
1.2 |
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BMT3263.1.5 |
1. |
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BMT3263.1.6 |
1.6A |
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BMT3263.2 |
2A |
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BMT3263.2.5 |
2. |
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BMT3263.3 |
3A |
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BMT3263.3.15 |
3.1 |
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BMT3263.3.5 |
3. |
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BMT3263.4 |
4A |
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BMT3263.5 |
3.5A
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BMT3263.6 |
6A |
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BMT3263.7 |
7A |
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BMT3263.8 |
8A |
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BMT3263.10 |
10A |
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BMT3263.12 |
12A |
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BMT3263.15 |
1 |
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BMT3263.16 |
16A |
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BMT3263.20 |
20A |
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BMT3263.25 |
2 |
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BMT3263.30 |
30A |
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BMT3263.35 |
35A |
80V/72V/63V/32V DC |
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BMT3263.40 |
40A |
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BMT3263.50 |
50A |
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BMT3263.60 |
60A |
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●DC Cold Resistance are measured at <10% of rated current in ambient temperature of 25℃;
●Typical Pre-arching I2t are calculated at 10*In Current or 8ms.
Temperature Derating Curve
Notes:
1. Derating depicted in this curve is in addition to the standard derating of 20% for continuous operation.
Example:For continuous operation at 75 degrees celsius, the fuse should be derated as follows:I = (0.80)(0.85)IRAT= (0.68)IRAT
Soldering Parameters
|
Reflow Condition |
Pb – Free assembly |
|
Pre Heat |
- Temperature Min (Ts(min)) 150°C |
|
- Temperature Max (Ts(max)) 200°C |
|
|
- Time (Min to Max) (ts) 60 – 120 secs |
|
|
Average ramp up rate (Liquidus Temp (TL) to peak |
3°C/second max. |
|
TS(max) to TL - Ramp-up Rate |
3°C/second max. |
|
Reflow |
- Temperature (TL) (Liquidus) 217°C |
|
- Temperature (tL) 60 – 90 seconds |
|
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Peak Temperature (TP) |
260+0/–5 °C |
|
Time within 5°C of actual peak Temperature (tp) |
20 – 40 seconds |
|
Ramp-down Rate |
5°C/second max. |
|
Time 25°C to peak Temperature (TP) |
8 minutes max. |
|
Do not exceed |
260°C |
|
Wave Soldering Parameters |
260°C Peak Temperature,3 seconds max. |
Dimensions and Structure
Product Characteristics
|
编号 NO. |
项目 Item |
内容 Content |
参考标准 Reference standards |
|
1 |
产品标识 Product Marking |
Brand, Ampere Rating |
marking standards |
|
2 |
工作温度 Operating Temperature |
-55°C to 125°C |
–55ºC to 125ºC with proper derating |
|
3 |
可焊性 Solderability |
T=240°C±5°C , t=3sec±0.5sec, Coverage≥95% |
MIL-STD-202, Method 208 |
|
4 |
耐焊接热 Resistance to Soldering Heat |
10 sec at 260°C |
MIL-STD-202, Method 210, Test condition B |
|
5 |
绝缘阻抗 Insulation Resistance (after Opening) |
10,000 ohms minimum
5 cycles, -65°C / +125°C, 15 minutes at each extreme |
MIL-STD-202, Method 302, Test Condition A |
|
6 |
热冲击 Thermal Shock |
MIL-STD-202, Method 107, Test Condition B |
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7 |
机械冲击 Mechanical Shock |
100G’s peak for 6 milliseconds, 3cycles |
MIL-STD-202, Method 213, Test I |
|
8 |
振动试验 Vibration |
0.03”amplitude, 10-55 Hz in 1 min. 2hrs each XYZ=6hrs |
MIL-STD-202, Method 201 |
|
9 |
耐湿性 Moisture Resistance |
10 cycles |
MIL-STD-202, Method 106 |
|
10 |
盐雾试验 Salt Spray |
5% salt solution, 48hrs |
MIL-STD-202, Method 101, Test Condition B |
Packaging
2,000 pcs in 13 inches dia. reel, 24mm wide tape, EIA Standard 481
