Features

■ Surface Mount Devices

■ Lead free device

■ Surface Mount packaging for automated assembly

■ Agency recognition: UL

Applications

Almost anywhere there is a low voltage power supply, up to 60V and a load to be protected, including:

■ Computer mother board, Modem. USB hub

■ PDAs & Charger, Analog & digital line card

■ Digital cameras, Disk drivers, CD-ROMs,

SMD 1812 SERIES

ROHS&RICH 

FU YUAN

MODEL

MARKING

Vmax

Imax

Ihold

Itrip

Pd

Maximum

Time To Trip

Resistance

(Vdc)

(A)

@25°C

(A)

@25°C

(A)

Max.

(W)

Current

(A)

Time

(Sec)

Rimin

(Ω)

R1max

(Ω)

SMD1812-010SF33V

33.0

30

0.10

0.30

0.8

0.5

1.50

0.750

15.000

SMD1812-010SF

30.0

30

0.10

0.30

0.8

0.5

1.50

0.750

15.000

SMD1812-010SF60V

60.0

30

0.10

0.30

0.8

0.5

1.50

0.750

15.000

SMD1812-014SF33V

33.0

30

0.14

0.34

0.8

1.5

0.15

0.650

6.000

SMD1812-014SF

60.0

30

0.14

0.34

0.8

1.5

0.15

0.650

6.000

SMD1812-020SF

30.0

30

0.20

0.40

0.8

8.0

0.02

0.350

5.000

SMD1812-020SF33V

33.0

30

0.20

0.40

0.8

8.0

0.02

0.350

5.000

SMD1812-020SF60V

60.0

30

0.20

0.40

0.8

8.0

0.02

0.350

5.000

SMD1812-030SF

30.0

30

0.30

0.60

0.8

8.0

0.10

0.250

3.000

SMD1812-030SF33V

33.0

30

0.30

0.60

0.8

8.0

0.10

0.250

3.000

SMD1812-030SF60V

60.0

30

0.30

0.60

0.8

8.0

0.10

0.250

3.000

SMD1812-050SF

15.0

30

0.50

1.00

0.8

8.0

0.15

0.150

1.000

SMD1812-050SF33V

33.0

30

0.50

1.00

0.8

8.0

0.15

0.150

1.000

SMD1812-050SF60V

60.0

30

0.50

1.00

0.8

8.0

0.15

0.150

1.400

SMD1812-075SF

13.2

30

0.75

1.50

0.8

8.0

0.20

0.090

0.450

SMD1812-075SF24V

24.0

30

0.75

1.50

0.8

8.0

0.20

0.090

0.450

SMD1812-075SF33V

33.0

30

0.75

1.50

0.8

8.0

0.20

0.090

0.450

SMD1812-110SF

8.0

35

1.10

2.20

0.8

8.0

0.30

0.045

0.250

SMD1812-110SF16V

16.0

35

1.10

2.20

0.8

8.0

0.30

0.050

0.250

SMD1812-110SF24V

24.0

35

1.10

2.20

0.8

8.0

0.30

0.050

0.250

SMD1812-110SF33V

33.0

35

1.10

2.20

0.8

8.0

0.30

0.050

0.250

SMD1812-125SF8V

8.0

35

1.25

2.50

0.8

8.0

0.40

0.050

0.140

SMD1812-125SF

16.0

35

1.25

2.50

0.8

8.0

0.40

0.050

0.140

SMD1812-150SF

8.0

35

1.50

3.00

0.8

8.0

0.50

0.040

0.160

SMD1812-150SF16V

16.0

35

1.50

3.00

0.8

8.0

0.50

0.040

0.160

SMD1812-150SF24V

24.0

35

1.50

3.00

0.8

8.0

0.50

0.040

0.160

SMD1812-150SF33V

33.0

35

1.50

3.00

0.8

8.0

0.50

0.040

0.160

SMD1812-160SF

8.0

35

1.60

2.80

0.8

8.0

1.00

0.030

0.130

SMD1812-200SF

8.0

35

2.00

4.00

0.8

8.0

2.00

0.020

0.100

SMD1812-200SF16V

16.0

35

2.00

4.00

0.8

8.0

2.00

0.020

0.100

SMD1812-200SF24V

24.0

35

2.00

4.00

0.8

8.0

2.00

0.020

0.100

SMD1812-260SF

8.0

35

2.60

5.00

0.8

8.0

2.50

0.010

0.050

SMD1812-260SF16V

16.0

35

2.60

5.00

0.8

8.0

2.50

0.010

0.050

SMD1812-260SF24V

24.0

35

2.60

5.00

0.8

8.0

2.50

0.010

0.050

SMD1812-300SF

8.0

35

3.00

5.00

0.8

8.0

4.00

0.010

0.040

SMD1812-300SF16V

16.0

35

3.00

5.00

0.8

8.0

4.00

0.010

0.040

SMD1812-350SF

6.0

35

3.50

6.00

2.0

10.0

4.00

0.008

0.030

SMD1812-350SF16V

16.0

35

3.50

6.00

2.0

10.0

4.00

0.008

0.030

SMD1812-400SF

6.0

35

4.00

7.00

2.0

10.0

4.00

0.005

0.025

SMD1812-400SF12V

12.0

35

4.00

7.00

2.0

10.0

4.00

0.005

0.025

SMD1812-400SF16V

16.0

35

4.00

7.00

2.0

10.0

4.00

0.005

0.025

Ihold  = Hold Current. Maximum current device will not trip in 25°C still air.

Itrip   = Trip Current. Minimum current at which the device will always trip in 25°C still air.

Vmax = Maximum operating voltage device can withstand without damage at rated current (Imax).

Imax  = Maximum fault current device can withstand without damage at rated voltage (Vmax).

Pd    = Maximum power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.

Rimin/max = Minimum/Maximum device resistance prior to tripping at 25°C.

R1max  = Maximum device resistance is measured one hour post reflow.

CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.

Environmental Specifications

Test

Conditions

Resistance change

Passive aging

+85°C, 1000 hrs.

±5% typical

Humidity aging

+85°C, 85% R.H. , 168 hours

±5% typical

Thermal shock

+85°C to -40°C, 20 times

±33% typical

Resistance to solvent

MIL-STD-202,Method 215

No change

Vibration

MIL-STD-202,Method 201

No change

Ambient operating conditions :         - 40 °C to 85 °C

Maximum surface temperature of the device in the tripped state is 125 °C

AGENCY APPROVALS :                                 U.L approved

Ihold versus temperature

MODEL

Maximum ambient operating temperature (Tmao) vs. hold current (Ihold)

-40°C

-20°C

0°C

25°C

40°C

50°C

60°C

70°C

85°C

SMD1812-010SF

0.16

0.14

0.12

0.10

0.08

0.07

0.06

0.05

0.03

SMD1812-014SF

0.23

0.19

0.17

0.14

0.12

0.10

0.09

0.08

0.06

SMD1812-020SF

0.29

0.26

0.23

0.20

0.17

0.15

0.14

0.12

0.10

SMD1812-030SF

0.44

0.39

0.35

0.30

0.26

0.23

0.21

0.18

0.15

SMD1812-050SF

0.59

0.57

0.55

0.50

0.45

0.43

0.35

0.30

0.23

SMD182R075SF

1.10

0.99

0.87

0.75

0.63

0.57

0.49

0.45

0.35

SMD1812-110SF

1.60

1.45

1.28

1.10

0.92

0.83

0.71

0.66

0.52

SMD1812-125SF

2.00

1.75

1.52

1.25

1.00

0.95

0.90

0.75

0.53

SMD1812-150SF

2.10

1.96

1.77

1.50

1.23

1.09

0.95

0.82

0.61

SMD1812-160SF

2.30

2.05

1.88

1.60

1.26

1.12

0.98

0.84

0.63

SMD1812-200SF

2.88

2.61

2.25

2.00

1.80

1.66

1.45

1.09

0.80

SMD1812-260SF

3.90

3.42

2.96

2.60

2.33

2.07

1.94

1.35

1.00

SMD1812-300SF

4.15

3.76

3.46

3.00

2.55

2.28

2.01

1.61

1.33

SMD1812-350SF

4.84

4.39

4.04

3.50

2.98

2.66

2.35

1.88

1.55

SMD1812-400SF

5.80

5.20

4.60

4.00

3.35

3.12

2.75

2.45

2.10

Termination pad characteristics

Terminal pad materials： Tin-Plated Nickle-Copper or Gold-Plated Nickle-Copper

Terminal pad solderability： Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.

Rework

Use standard industry practices, the removal device must be replaced with a fresh one.

Thermal derating curve

Typical time-to-trip at 25°C

!WARNING

· Use PPTC beyond the maximum ratings or improper use may result in device damage and possible electrical arcing and flame.

· PPTC are intended for protection against occasional over current or over temperature fault conditions and should not be used when repeated

fault conditions or prolonged trip events are anticipated.

· Device performance can be impacted negatively if devices are handled in a manner inconsistent with recommended electronic, thermal, and

mechanical procedures for electronic components.

· Use PPTC with a large inductance in circuit will generate a circuit voltage (L di/dt) above the rated voltage of the PPTC.

· Avoid impact PPTC device its thermal expansion like placed under pressure or installed in limited space.

· Contamination of the PPTC material with certain silicon based oils or some aggressive solvents can adversely impact the performance of the

devices. PPTC SMD can be cleaned by standard methods.

· Requests that customers comply with our recommended solder pad layouts and recommended reflow profile. Improper board layouts or

reflow profile could negatively impact solderability performance of our devices.

Soldering Parameters                                                     

      Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free

      Recommended maximum paste thickness is 0.25mm

      Devices can be cleaned using standard industry methods and solvents.

      Note 1:All temperature refer to topside of the package, measured on the package body surface.

      Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.

‧Recommended reflow methods：IR, vapor phase oven, hot air oven.

‧Devices are not designed to be wave soldered to the bottom side

of the board.

‧Recommended maximum paste thickness is 0.25 mm (0.010 inch).

‧Devices can be cleaned using standard method and solvents.

Note：If reflow temperatures exceed the recommended profile,

devices may not meet the performance requirements.

Tape and reel specifications (mm)

Governing Specifications      EIA 481-1

W

12 ± 0.3

P0

4.0 ± 0.10

P1

8.0 ± 0.10

P2

2.0 ± 0.05

A0

3.5 ± 0.10

B0

5.1 ± 0.10

B1max.

5.9

D0

1.5 + 0.1, -0

F

5.5 ± 0.05

E1

1.75 ± 0.10

E2min.

10.25

T

0.6

T1max.

0.1

K0

0.90±0.1

Leadermin.

390

Trailermin.

160

Reel Dimensions

A max.

178

N min.

60

W1

12.4 ± 0.5

‧ Storage conditions：40°C max, 70% R.H.

‧ Devices may not meet specified performanc if storage conditions are exceeded.

Order information Packaging

SMD1812 110   SMD：surface mount device  Current 1.1A Tape & Reel Quantity  1500/2000 pcs/reel