一次性贴片保险丝|SMD保险丝

    Description

    The SMD1032 fuse is RoHS compliant,Halogen Free and 100% lead-free. This product is fully compatible with lead-free solder alloys and higher temperature profiles associated with lead-free assembly.The SMD1032 design has enhanced inrush withstand characteristics over . The unique time delay feature of this fuse design helps solve the problem of nuisance “opening” by accommodating inrush currents that normally cause a fast-acting fuse to open。

     

    Features

    • Lead-free and Halogen Free • Time-lag• Small size • Wide range of current ratings available • Wide operating temperature range• Low temperature de-rating

     

    Applications

    Secondary protection for space constrained applications:

    • Notebook PC • LCD/PDP TV • LCD monitor • LCD/PDP panel • LCD backlight inverter • Portable DVD player • Power supply• Networking • PC server • Cooling fan system • Storage system • Telecom system • Wireless basestation • Game console • Office Automation equipment • Battery charging circuit protection • Industrial equipment• Medical equipment • Automotive



    Dimensions


    Material Details

    NO.

    Part Name

    Material

    1

     End caps

    Copper nickel/tin plating

    2

     Body

     Ceramic Tube

    3

     Fuse

    Alloy wire

    4

    Explosion proof sand

    Quartz sand


    Electrical Characteristics for Series

    % of Ampere  rating

    OpeningTime

    100%

    4 hours, Minimum

    200%

      60 sec., Max.



    Electrical Specifications by Item

    Catalog Number

    Ampere Rating

    MaxVoltage

    Rating(V)

    Interrupting

    Rating

    Nominal Resistance Cold mOhms

    Nominal Melting i2tA2Sec.

    Agency Approvals

    CE

    UR

    CQC

    .100

    .100

    250V/300VAC

    72V/125VAC/DC

    100A @125VAC

    300A @ 65VAC

    300A @ 100VDC

    1000A @ 32VDC

    500A @ 72VDC

    3.300

    0.00160

    ×

    ×

     

    .125

    .125

    2.300

    0.00790

    ×

    ×

     

    .160

    .160

    1.700

    0.0128

    ×

    ×

     

    .200

    .200

    0.500

    0.0200

    ×

    ×

    ×

    .250

    .250

    0.630

    0.312

    ×

    ×

    ×

    .315

    .315

    0.460

    0.422

    ×

    ×

    ×

    .400

    .400

    0.360

    0.755

    ×

    ×

    ×

    .500

    .500

    0.310

    1.32

    ×

    ×

    ×

    .630

    .630

    0.178

    2.55

    ×

    ×

    ×

    .800

    .800

    0.125

    3.25

    ×

    ×

    ×

    .001

    1.00

    0.092

    6.95

    ×

    ×

    ×

    1.25

    1.25

    0.065

    12.1

    ×

    ×

    ×

    01.6

    1.60

    0.048

    18.2

    ×

    ×

    ×

    002.

    2.00

    0.035

    20.8

    ×

    ×

    ×

    02.5

    2.50

    0.028

    32.5

    ×

    ×

    ×

    3.15

    3.15

    0.020

    40.8

    ×

    ×

    ×

    004.

    4.00

    0.016

    95.0

    ×

    ×

    ×

    005.

    5.00

    0.014

    140

    ×

    ×

    ×

    06.3

    6.30

    0.009

    240

    ×

    ×

    ×

    008

    8

    0.0072

    320

    ×

    ×

    ×

    010

    10

    0.0065

    430

    ×

    ×

    ×

    Notes: - l2t calculated at 8ms. Resistance is measured at 10% of rated current, 23ºC



    Temperature Derating Curve

     

     

    Notes:

    1.  Derating depicted in this curve is in addition to the standard derating of 20% for continuous operation.

    Example:For continuous operation at 75 degrees celsius, the fuse should be derated as follows:I = (0.80)(0.85)IRAT= (0.68)IRAT

    Reflow Condition

    Pb – Free assembly

    Pre Heat

    - Temperature Min (Ts(min)) 150°C

    - Temperature Max (Ts(max)) 200°C

    - Time (Min to Max) (ts) 60 – 120 secs

    Average ramp up rate (Liquidus Temp (TL) to peak

    3°C/second max

    TS(max) to TL - Ramp-up Rate

    3°C/second max

    Reflow

    - Temperature (TL) (Liquidus) 217°C

    - Temperature (tL) 60 – 90 seconds

    Peak Temperature (TP)

     260+0/–5 °C

    Time within 5°C of actual peak Temperature (tp)

    20 – 40 seconds

    Ramp-down Rate

    5°C/second max.

    Time 25°C to peak Temperature (TP)

    8 minutes max.

    Do not exceed

     260°C

    Wave Soldering Parameters

    260°C Peak Temperature,3 seconds max.

    Soldering Parameters

     

     

     

     

     

     

    Product Characteristics

    Materials

    Body: Ceramic Terminations: Gold-plated Caps

    Product Marking

    Brand, Amperage Rating

    Operating Temperature

    -55°C to 300V°C

    Moisture Sensitivity Level

    Level 1, J-STD-020C

    Solderability

    MIL-STD-202, Method 208

    Insulation Resistance (after Opening)

    MIL-STD-202, Method 302,

    Test ConditionA (10,000 ohms minimum)

    Thermal Shock

    MIL-STD-202, Method 107, Test Condition B, 5 cycles, -65°C to 300V°C, 15 minutes @ each extreme

    Mechanical Shock

    MIL-STD-202, Method 213, Test I:Deenergized. 100G’s pk amplitude, sawtooth wave 6ms duration, 3 cycles xYZ+xyz = 18 shocks

    Vibration

    MIL-STD-202, Method 201: 0.03" amplitude, 10-55 Hz in 1 min. 2hrs each xYZ=6hrs

    Moisture Resistance

    MIL-STD-202, Method 106, 10 cycles

    Salt Spray

    MIL-STD-202, Method 101, Test Condition B (48hrs)

    Resistance to Soldering Heat

    MIL-STD-202, Method 210, Test condition B (10 sec at 260°C)

     

       

    Packaging

     

    packaging Option

    packaging Specification

    Quantity

    Quantity &packaging code

    24 mm Tape and Reel

    EIA RS-481-2

    2000

    ER


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