一次性贴片保险丝|SMD保险丝


    Description

    The SMD2410 fuse is RoHS compliant,Halogen Free and 100% lead-free. This product is fully compatible with lead-free solder alloys and higher temperature profiles associated with lead-free assembly.The SMD2410 design has enhanced inrush withstand characteristics over . The unique time delay feature of this fuse design helps solve the problem of nuisance “opening” by accommodating inrush currents that normally cause a fast-acting fuse to open

     

    Features

    • Lead-free and Halogen Free • Time-lag• Small size • Wide range of current ratings available • Wide operating temperature range• Low temperature de-rating

     

    Applications

    Secondary protection for space constrained applications:

    • Notebook PC • LCD/PDP TV • LCD monitor • LCD/PDP panel • LCD backlight inverter • Portable DVD player • Power supply• Networking • PC server • Cooling fan system • Storage system • Telecom system • Wireless basestation • Game console • Office Automation equipment • Battery charging circuit protection • Industrial equipment• Medical equipment • Automotive

     

     

    Dimensions

     

    Material Details

     

    NO.

    Part Name

    Material

    1

     End caps

    Copper nickel/tin plating

    2

     Body

     Ceramic Tube

    3

    Wire

    Alloy wire

    4

    Explosion proof sand

    Quartz sand

     

       

    Electrical Characteristics for Series

    % of Ampere  rating

    OpeningTime

    100%

    4 hours, Minimum

    200%

      60 sec., Max.

     

    Electrical Specifications by Item

    Catalog

    Number

    Ampere

    Rating

    MaxVoltage

    Rating(V)

    Interrupting

    Rating

    NominalCold

    Resistance

    (Ohms)

    Nominal

    Melting i2t(A2Sec).

    AgencyApprovals

    UL

    CCC

    .062

    .062

    250V/300VAC

    72V/125VAC/DC

    100A @125VAC

    300A @ 65VAC

    300A @ 100VDC

    1000A @ 32VDC

    500A @ 72VDC

    7.000

    0.000113

    ×

     

    .125

    .125

    1.700

    0.00174

    ×

     

    .250

    .250

    0.665

    0.0116

    ×

     

    .375

    .375

    0.395

    0.0296

    ×

    ×

    .500

    .500

    0.280

    0.0598

    ×

    ×

    .630

    .630

    0.205

    0.094

    ×

    ×

    .750

    .750

    0.175

    0.153

    ×

    ×

    001.

    .1.00

    0.128

    0.256

    ×

    ×

    1.25

    .1.25

    0.100

    0.390

    ×

    ×

    01.5

    .1.50

    0.0823

    0.587

    ×

    ×

    002.

    .2.00

    0.0473

    0.405

    ×

    ×

    02.5

    2.50

    0.0360

    0.721

    ×

    ×

    003.

    3.00

    0.0290

    1.19

    ×

    ×

    03.5

    3.50

    0.0240

    1.58

    ×

    ×

    004.

    4.00

    0.0204

    2.45

    ×

    ×

    005.

    5.00

    0.0155

    4.14

    ×

    ×

    006.

    6.00

    0.0128

    7.36

    ×

    ×

    007.

    7.00

    0.0105

    10.4

    ×

    ×

    010.

    10.0

    0.00705

    25.5

    ×

    ×

    012.

    12.0

    0.0055

    45.2

    ×

    ×

    015.

    15.0

    0.00446

    68.8

    ×

    ×

    Notes: - l2t calculated at 8ms. Resistance is measured at 10% of rated current, 23ºC

     

    Temperature Derating Curve

     

     Notes:

    1.  Derating depicted in this curve is in addition to the standard derating of 20% for continuous operation.

    Example:For continuous operation at 75 degrees celsius, the fuse should be derated as follows:I = (0.80)(0.85)IRAT= (0.68)IRAT

    Average Time Current Curves

     

    Soldering Parameters

    Reflow Condition

    Pb – Free assembly

    Pre Heat

    - Temperature Min (Ts(min)) 150°C

    - Temperature Max (Ts(max)) 200°C

    - Time (Min to Max) (ts) 60 – 120 secs

    Average ramp up rate (Liquidus Temp (TL) to peak

    3°C/second max

    TS(max) to TL - Ramp-up Rate

    3°C/second max

    Reflow

    - Temperature (TL) (Liquidus) 217°C

    - Temperature (tL) 60 – 90 seconds

    Peak Temperature (TP)

     260+0/–5 °C

    Time within 5°C of actual peak Temperature (tp)

    20 – 40 seconds

    Ramp-down Rate

    5°C/second max.

    Time 25°C to peak Temperature (TP)

    8 minutes max.

    Do not exceed

     260°C

    Wave Soldering Parameters

    260°C Peak Temperature,3 seconds max.

     

     

     

    Product Characteristics

    Materials

    Body: Ceramic Terminations: Gold-plated Caps

    Product Marking

    Brand, Amperage Rating

    Operating Temperature

    -55°C to 300V°C

    Moisture Sensitivity Level

    Level 1, J-STD-020C

    Solderability

    MIL-STD-202, Method 208

    Insulation Resistance (after Opening)

    MIL-STD-202, Method 302,

    Test ConditionA (10,000 ohms minimum)

    Thermal Shock

    MIL-STD-202, Method 107, Test Condition B, 5 cycles, -65°C to 300V°C,

    15 minutes @ each extreme

    Mechanical Shock

    MIL-STD-202, Method 213, Test I:Deenergized. 100G’s pk amplitude, 

    sawtooth wave 6ms duration, 3 cycles xYZ+xyz = 18 shocks

    Vibration

    MIL-STD-202, Method 201: 0.03" amplitude, 10-55 Hz in 1 min. 2hrs each xYZ=6hrs

    Moisture Resistance

    MIL-STD-202, Method 106, 10 cycles

    Salt Spray

    MIL-STD-202, Method 101, Test Condition B (48hrs)

    Resistance to Soldering Heat

    MIL-STD-202, Method 210, Test condition B (10 sec at 260°C)

     

     

    Packaging

     

    packaging Option

    packaging Specification

    Quantity

    Quantity &packaging code

    24 mm Tape and Reel

    EIA RS-481-2

    1000

    ER

     

     

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