Performance Specification
|
Model |
V max
(V dc) |
Imax
(A) |
I hold @25°C (A) |
I trip @25°C (A) |
Pd Typ. (W) |
Maximum Time To Trip |
Resistance |
||
|
Current (A) |
Time (Sec) |
R i min (W) |
R1max (W) |
||||||
|
SMD2018-030SF |
60 |
10 |
0.30 |
0.60 |
0.9 |
1.5 |
3.00 |
0.500 |
2.300 |
|
SMD2018-050SF |
60 |
10 |
0.55 |
1.20 |
1.0 |
2.5 |
3.00 |
0.200 |
1.000 |
|
SMD2018-075SF |
60 |
10 |
0.75 |
1.50 |
1.1 |
8.0 |
0.30 |
0.110 |
0.630 |
|
SMD2018-100SF |
15 |
35 |
1.10 |
2.20 |
1.1 |
8.0 |
0.40 |
0.060 |
0.360 |
|
SMD2018-100SF33V |
33 |
35 |
1.10 |
2.20 |
1.1 |
8.0 |
0.40 |
0.060 |
0.360 |
|
SMD2018-150SF |
15 |
35 |
1.50 |
3.00 |
1.1 |
8.0 |
0.80 |
0.050 |
0.170 |
|
SMD2018-200SF |
10 |
35 |
2.00 |
4.00 |
1.1 |
8.0 |
2.40 |
0.030 |
0.100 |
V max = Maximum operating voltage device can withstand without damage at rated current (Imax).
I max = Maximum fault current device can withstand without damage at rated voltage (V max).
I hold = Hold Current. Maximum current device will not trip in 25°C still air.
I trip = Trip Current. Minimum current at which the device will always trip in 25°C still air.
Pd = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.
Ri min/max = Minimum/Maximum device resistance prior to tripping at 25°C.
R1max = Maximum device resistance is measured one hour post reflow.
CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.
Environmental Specifications
|
Test |
|
|
|
Conditions |
|
|
|
Resistance change |
|
|
|
Passive aging |
|
|
|
+85°C, 1000 hrs. |
|
|
±5% typical |
|
|
|
|
Humidity aging |
|
|
|
+85°C, 85% R.H. , 168 hours |
|
±5% typical |
|
|
||
|
Thermal shock |
|
|
|
+85°C to -40°C, 20 times |
|
|
±33% typical |
|
||
|
Resistance to solvent |
|
|
|
MIL-STD-202,Method 215 |
|
|
No change |
|
|
|
|
Vibration |
|
|
|
MIL-STD-202,Method 201 |
|
|
No change |
|
|
|
|
Ambient operating conditions : - 40 °C to +85 °C |
||||||||||
|
Maximum surface temperature of the device in the tripped state is 125 °C |
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Thermal Derading Chart
Recommended Hold Current(A) at Ambient Temperature(°C)
|
Model |
Ambient Operation Temperature |
||||||||
|
-40°C |
-20°C |
0°C |
25°C |
40°C |
50°C |
60°C |
70°C |
85°C |
|
|
SMD2018-030SF |
0.48 |
0.42 |
0.35 |
0.30 |
0.24 |
0.21 |
0.17 |
0.15 |
0.10 |
|
SMD2018-050SF |
0.87 |
0.77 |
0.67 |
0.55 |
0.46 |
0.41 |
0.36 |
0.31 |
0.23 |
|
SMD2018-075SF |
1.19 |
1.05 |
0.91 |
0.75 |
0.61 |
0.54 |
0.47 |
0.41 |
0.32 |
|
SMD2018-100SF |
1.71 |
1.52 |
1.32 |
1.10 |
0.94 |
0.84 |
0.74 |
0.64 |
0.50 |
|
SMD2018-150SF |
2.38 |
2.10 |
1.82 |
1.50 |
1.27 |
1.13 |
0.99 |
0.85 |
0.64 |
|
SMD2018-200SF |
2.95 |
2.65 |
2.35 |
2.00 |
1.74 |
1.59 |
1.44 |
1.29 |
1.06 |
Thermal Derating Curve
Average Time-Current Curve
Soldering Parameters
|
Profile Feature |
Pb-Free Assembly |
|
Average Ramp-Up Rate(Ts max to T p) |
3℃/second mac. |
|
Preheat -Temperature Min(Ts min) -Temperature Max(Ts max) -Time(Ts min to Ts max) |
150℃ 200℃ 60~180 seconds |
|
Time maintained above: -Temperature(TL) -Time(tL) |
217℃ 60~150 seconds |
|
Peak Temperature(Tp) |
260℃ |
|
Ramp-Down Rate |
6℃/second max. |
|
Time 25℃ to Peak Temperature |
8 minutes max |
|
Storage Condition |
0℃~30℃,30%~60%RH |
Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment for lead-free
Recommended maximum paste thickness is 0.25mm
Devices can be cleaned using standard industry methods and solvents.
Note 1:All temperature refer to topside of the package, measured on the package body surface.
Note 2: If reflow temperatures exceed the recommended profile, devices may not meet the performance requirements.
Physical Dimensions(mm.)
|
Model |
A |
B |
C |
D |
E |
|||
|
Min. |
Max. |
Min. |
Max. |
Min. |
Max. |
Min. |
Min. |
|
|
SMD2018-030SF |
4.72 |
5.44 |
4.22 |
4.93 |
0.50 |
1.20 |
0.30 |
0.25 |
|
SMD2018-050SF |
4.72 |
5.44 |
4.22 |
4.93 |
0.50 |
1.20 |
0.30 |
0.25 |
|
SMD2018-075SF |
4.72 |
5.44 |
4.22 |
4.93 |
0.50 |
1.20 |
0.30 |
0.25 |
|
SMD2018-100SF |
4.72 |
5.44 |
4.22 |
4.93 |
0.50 |
1.20 |
0.30 |
0.25 |
|
SMD2018-100SF33V |
4.72 |
5.44 |
4.22 |
4.93 |
0.50 |
1.20 |
0.30 |
0.25 |
|
SMD2018-150SF |
4.72 |
5.44 |
4.22 |
4.93 |
0.50 |
1.20 |
0.30 |
0.25 |
|
SMD2018-200SF |
4.72 |
5.44 |
4.22 |
4.93 |
0.50 |
1.20 |
0.30 |
0.25 |
Termination Pad Characteristics
Terminal pad materials：Tin-plated Nickel-Copper
Terminal pad solder ability：Meets EIA specification RS186-9E and ANSI/J-STD-002 Category 3.
Recommended Pad Layout (mm.)
|
Tape And Reel Specifications (mm)
|
|
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Part Number System
SMD 2018 - 口口口 S F 口口V
special voltage Rating(Optional)
Lead-Free
Tin-plated Nickel-Copper
Holding Current Rating
Device Dimensions: Length/width(Unit:1/100 inch) Size 5045 mm / 2018 inch
Surface Mount Device
